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MOTEK / BONDexpo
10th – 13th October 2011
Exhibition Centre Stuttgart (Germany)

Dear Sir,

The international trade fair for handling, assembly and automation technology MOTEK invites you to experience the latest technical developments displayed at the Exhibition Centre Stuttgart, Germany. Together with the BONDexpo, trade fair for industrial bonding technology, a future-oriented trade fair program awaits you in Stuttgart presented by more than 1.000 exhibitors. The Exhibition Centre is directly adjacent to the Stuttgart International Airport – a fact which offers ideal travel conditions for visitors from all over the world.

The MOTEK which celebrates its 30th anniversary in 2011 is the world’s leading event in the fields of production and assembly automation, feed technology and material flow, streamlining and handling technology as well as industrial handling. Beyond this, the MOTEK is the only technical event which presents the entire world of automation – from components and subsystems to complete solutions.

Focal target groups for MOTEK topics include automobile, machinery and equipment manufacturing, the electrical and electronics industries, medical engineering and solar production, as well as the metal and plastic processing industries in general, and their suppliers.

The complementary trade fair BONDexpo adds an important current spectrum of topics to the MOTEK program: Whether in the field of lightweight construction, joining of different materials or hybrid solutions – industrial bonding technology is considered to be the joining technology of the future.

Get your first-hand information at the MOTEK and the BONDexpo in Stuttgart, Germany. We are looking forward to welcome you!

Paul E. Schall and Bettina Schall
Managing Directors

www.motek-messe.de